Hybrid Circuit Assembler

Job description

Job Description Job Description Responsibilities/Duties: 1. Manual placement of semiconductor dice in cleanroom environment 2. Use of tweezers, microscope and wire-bonder to manually place and connect semiconductor dice. 3. Operate automated and semi-automated die-attach and wire-bonding machines to position and attach semiconductor and other hybrid components 4. Work from approved drawings and assembly instructions with strict adherence to quality and environmental standards. Education : High …

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